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JUKI FX-1R

AdvancedlinearmotoranduniqueHI-Drivemechanismforhigh-speedmountingThatis,itinheritsthetraditionalconceptofamodularmounterandrealizesahigh-speedmounter.Reasonableadjustmentofeachpartimprovestheactualplacementspeed.33,000CPH:Chip(optimalconditions)/25,000CPH:Chip(IPC9850)Laserpatchhead×2(8nozzles)0603(Inch0201)chipto20mmsquareelement,or26.5×11mm0402(Inch01005)chipisfactoryoptionDifferencesinplacementspeedconditions SubstratesizeForLsubstrate(410×360mm)Componentsize Laserrecognition0603chip(Inch0201)chip~20mmsquareelementOr26.5×11mm*1ComponentplacementspeedChipcomponents 33,000CPH*2(optimalconditions)25,000CPH(IPC9850)ComponentplacementaccuracyLaserrecognition ±0.05mmComponentplacementtypesUpto80types(convertedto8mmtape)Devicesize(W×D×H*3) 1,880×1,731×1,490mmweightAbout2,000kg
Product description
Parameters
Advanced linear motor and unique HI-Drive mechanism for high-speed mounting
That is, it inherits the traditional concept of a modular mounter and realizes a high-speed mounter. Reasonable adjustment of each part improves the actual placement speed.
33,000CPH: Chip (optimal conditions) / 25,000 CPH: Chip (IPC 9850)
Laser patch head × 2 (8 nozzles)
0603 (Inch 0201) chip to 20mm square element, or 26.5 × 11mm
0402 (Inch 01005) chip is factory option
Differences in placement speed conditions
 
Substrate size
For L substrate (410 × 360mm)
Component size
 
Laser recognition
0603 chip (Inch 0201) chip ~ 20mm square element
Or 26.5 × 11mm * 1
Component placement speed
Chip components
 
33,000CPH * 2 (optimal conditions)
25,000CPH (IPC9850)
Component placement accuracy
Laser recognition
 
± 0.05mm
Component placement types
Up to 80 types (converted to 8mm tape)
Device size (W × D × H * 3)
 
1,880 × 1,731 × 1,490mm
weight
About 2,000kg
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SHENZHEN RECREATE ELECTRONICS EQUIPMENT CO.,LTD. 粤ICP证05154540号